REMOVES HARSH DEFECTS EFFORTLESSLY
Q²M Compound is a cutting paste, delivering excellent performance and a high level of scratch removal combined with a very low level of dust and an incomparable finish. Correct technique combined with an eccentric polisher allows to use Q²M Compound as a one step product.
HIGH CUTTING POWER AND GLOSSY FINISH
A significant level of cutting power comes with an impressively low dust level and high quality finish. Q²M Compound formula is water-based and contains high quality Japanese abrasives, allowing great results in just one cutting paste. No silicone or fillers make the procedure of pre-coating preparation and polish removal much easier and quicker.
ADVICE ON APPLICATION AND PRECAUTIONS
Work with a polishing machine of your choice (rotary, dual-action or orbital with forced rotation). Spread at low revs. Work until fully diminished at medium revs. Wipe off with an HQ microfiber cloth. Use a 1:1 dilution of IPA to remove the remaining product and inspect the effect. If needed, re-use.